Meet FieldFab:
the expeditionary 3D printer designed for the world’s extreme environments.
Replace mission-critical parts in the field, reducing lead time and enabling material readiness.
Designed to MIL-STD 810H, FieldFab has demonstrated consistent performance during:
Extreme cold (-40°C), extreme heat (50°C), and high altitude
Temperature and humidity cycling
Rain and condensation
Operational shock and vibration
Print advanced materials continuously, even during tactical transport on land, sea, or in air.
Our unique capabilities result from being embedded within USMC and Army units for over 3 years and codeveloping our system with warfighters.
As a part of our Cooperative Research and Development Agreement (CRADA) with USMC, NIWC Pacific, and US Army CCDC, we have conducted over 25 field deployments to date.
Print advanced, high-temperature materials with minimal new-operator training (less than 4 hours).
FieldFab is compatible with all polymer-based 3D printing filaments.
Direct Metal Replacements
Biocompatible Parts
Flexible Parts
Standard Parts
Technical Specifications
3D PRINTING
Nozzle Temperature | < 500°C (932°F) |
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Bed Temperature | < 200°C (392°F) |
Chamber Temperature | < 80°C (176°F) |
Print Volume | 280mm x 280mm x 280mm (11.02” x 11.02” x 11.02”) |
Supported Materials | All standard polymer filaments and polymer- based composites (i.e. ULTEM, TPU, Nylon-CF, PETG, Nylon, PLA, etc.) |
MECHANICALS
Housing | LMDP plastic exterior, aluminum print shell |
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Dimensions | 24” x 26” x 39” |
Weight | 190 lbs |
ENVIRONMENTALS
Temperature | Operational: 40°C* to 50°C (-40°F* to 122°F) * automatic system pre-heat enabled Storage: -40°C to 70°C (-40°F to 158°F) |
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Certifications | MIL-STD-810H, AS9100D/ISO9001, Made in USA |
INTERFACE / ELECTRONICS
Digital Interface | GETAC F110 with design suite, digital data vault access |
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Power | 80V—264V, 47Hz—63Hz (AC outlet) |
Power Consumption | 1.2kW peak, 10A Max |